PCB Terminology (Chinese – English)

A summary of Printed Circuit Board terminology (Chinese vs. English). Learn More.

PCB Introduction

Printed Circuit Board (PCB) are used in almost all kinds of electronic equipment. They are the supporter of electrical connections for electronic components. Read more for a brief introduction on PCB technology. Learn More.

PCB Process Flow

How is Printed Circuit Board manufactured? What are the major procedures during production? Learn More.

PCB Surface Finishing

What are different types of PCB surface finishing? What are the pros and cons of these finishing? Learn More.

PCB Types

What are different types of PCB surface finishing? What are the pros and cons of these finishing? Learn More.

Millimeter Wave Automotive Radar PCB

The auto anti-collision radar is the most important part of the developing trends of future automotive technology. Millimeter Wave (MMW) radar has advantages in auto-collision avoidance technology. Learn More.

High Density Interconnector (HDI) PCB

High Density Interconnector (HDI) is the cutting-edge technology for the production of printed circuit boards. There are mainly two HDI structures: buildup and any-layer.  Learn More.

PCB Material Selection

How to choose suitable materials for PCB structure? Our engineers concluded there are three main properties to be considered. Learn More.

High-Speed Material for PCB

The creation of high-speed digital is increasingly important. Designers use a series of material parameters such as the dissipation factor (Df) and the dielectric constant (Dk) to determine the suitability of high-speed PCB materials. Learn More.

The PCB Substrate Materials

This article aims to introduce the different types of materials used in the printed circuit board(PCB) substrates. The commonly used substrates include the organic substrate(FR-4), ceramic substrate, and metal substrate. Learn More.

PCB Etching Techniques

Etching is a technique to remove unwanted materials from the surface. This article intends to introduce two types of etching techniques: wet etching and dry etching. Learn More.

Laser Drilling

This article aims to introduce the working principles of laser drilling in PCB. It also covers four laser drilling methods: single pulse, percussion, trepanning and helical drilling. Learn More.

HDI Layout Guidelines

This article aims to introduce HDI Layout. The content includes challenges, features, component selection and package styles. Learn More.

Mechanical Drilling vs. Laser Drilling

This article intends to provide a brief introduction to mechanical drilling, laser drilling and aspect ratio. It also covers the advantages and disadvantages of using mechanical drilling and laser drilling. Learn More.

Guidelines for RF and Microwave PCB Design

This article aims to provide guidelines for both Radio frequency(RF) and microwave printed circuit board design. RF PCB is operating above 100MHz, while microwave PCB is operating above 2GHz. Learn More.

PCB Prepreg

The prepreg acts as an insulator, bonding cores and copper foil together to make a strong PCB. This article briefly introduces what prepreg is and the differences between prepreg and core. Learn More.

PCB Back Drilling

Back drilling is used to remove conductive via stubs of the copper barrel in the through-hole in printed circuit boards (PCB). The stub can result in serious signal integrity problems in the high-speed design. Learn More.



How to design PCBs?

PCB designs begins when a electronic engineer chooses the components required to perform the functions of the end product and then determines the best way to connect those components electrically. The design gives the manufacturer a lot of information including the PCB dimension, hole sizes and positions, and overall mechanical definition; it may also incorporate notes referring type of material, specifications, UL requirements, solder mask, and test requirements. Learn More.



Double-sided PCB Manufacturing

The double-sided PCB (or 2-layer PCB) is the printed circuit board with copper coated on both sides, top and bottom. There is an insulating layer in the middle. To use circuits on both sides, there must be a proper circuit connection between the two sides.  The “bridges” between such circuits are call vias. A via is a small hole on the PCB board coated with metal, which can be connected with circuits on both sides. Learn More.


Selection Of Interconnection

Selections of the packaging approaches among the various elements is dictated not only by system function, but also by the component types selected and by the operation parameters of the system, such as the clock speeds, power consumption, and heat management methods, and the environment in which the system will operate. Learn More.